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The Angstrom Engineering system supports both electron beam evaporation and dual-head sputtering for versatile thin film deposition. It features high-vacuum e-beam sources for precise material control and two sputter heads with RF, DC, and pulsed DC capabilities—ideal for metals, dielectrics, and complex multilayers. This flexible platform enables high-quality coatings for optics, electronics, and nanodevices with fine control over thickness, uniformity, and composition.

Tool Specifications:Ìý

• 6x7cc pocket e-beam evaporator with a 6 kW (10 kV-600 mA) solid state power supply.
• Programmable sweep pattern and rate control.
• Two 3-inch sputter targets.
• 1.0 kW solid state pulsed DC power supply capable of running in DC or pulsed DC mode, 0-100 kHz pulse frequency, 0-800 V | 0-2.5 A.
• 600 W RF Power Supply and Matching Network, 13.56 MHz power supply with automatic matching network.
• Rotating substrate stage with temperature control from ambient to 600C, height control, and up to 100 W RF bias.

The Angstrom Engineering EvoVac is a versatile thermal evaporator designed for high-quality thin film deposition. It features two thermal sources and two Radak II electron beam sources, enabling precise control over a wide range of materials. With high-vacuum operation and programmable deposition parameters, the EvoVac supports multilayer stacks, co-deposition, and uniform coatings for optics, electronics, and nanofabrication. Its flexible configuration makes it ideal for research.

The Beneq TFS 200 is a versatile atomic layer deposition (ALD) system optimized for thermal processes. It delivers precise, conformal coatings of aluminum, titanium, and tin oxides on wafers and 3D substrates. With nanometer-scale thickness control and uniformity, it supports high-quality films for electronics, optics, and barrier layers.Ìý

Tool Specifications:Ìý

Precursors include Trimethylaluminum (TMA), Water, Titanium tetrachloride (TTC), Diethylzinc (DEZ), (Tetrakis)dimethylamido tin (IV) (TDMA-Sn), and Oxygen/Ozone

• Reliable thin film deposition system designed for metals and dielectrics.
• Uses resistive heating to evaporate materials from thermal sources under high vacuum, enabling uniform coatings with precise thickness control.
• Ideal for single-layer films and simple stacks, it supports up to 4-inch substrates.

Tool Specifications:Ìý

• 300 Watt, 13.56 MHz
• Pressures typically ranging from 100-500 mT
• Chamber has a 5 inch diameter lower electrode that can accommodate wafer pieces and full wafers up to 4 inches

A chlorine-based inductively coupled plasma etcher configured for precise, anisotropic etching of chalcogenide materials.Ìý

Designed for substrates up to 4 inches,Ìýpieces can also be mounted on carrier wafers for flexible sample handling. It features independent RF bias and ICP power control for fine-tuned ion energy and density.

Tool Specifications:

• Plumbed with Cl2, BCl3, O2, CHF3, Ar, N2.
• This tool is currently restricted to III-V materials.
• Mechanical clamp accepts 4 inch wafers, smaller wafers or wafer pieces can be mounted to 4 inch carrier wafers.
• He backside cooling is available.
• ICP generator: 2000 W at 2 MHz
• RF generator: 600 W at 13.56 MHz
• Platen temperature 20C to 40C
• Chamber Temp 20c to 100C

• A deep reactive ion etching (DRIE) system designed for high-aspect-ratio silicon etching.
• Uses inductively coupled plasma (ICP) with alternating passivation and etch cycles to achieve vertical profiles with excellent selectivity and sidewall control.

• A downstream plasma asher designed for gentle, uniform removal of photoresist and organic residues.
• Generates plasma remotely, allowing only neutral radicals to reach the substrate—ideal for damage-sensitive materials and delicate structures.Ìý

• High-resolution digital microscope designed for advanced imaging and analysis of microstructures.
• Variable magnification with real-time depth composition, enabling fully focused 3D-like images across uneven surfaces.
• Configured for samples up to 4 inches, it includes a lithography inspection filter and height measurement capabilities.
• Supports both 2D and 3D image stitching for wide-area visualization, and features a tilting head for off-axis observation of complex topographies.

• Programmable digital hot plates with integrated magnetic stirring, designed for precise heating and mixing in cleanroom and laboratory environments.
• The plates feature a chemically resistant 6" × 6" top plate (ceramic or aluminum respectively), with temperature control up to 450 °C and ±1% accuracy.
• Supports multi-step programmable profiles, repeatable ramp/hold cycles, and external probe feedback for solution-based temperature control.
• Ideal for resist baking, solution heating, and uniform mixing during sample preparation and wet processing.

• Stainless steel solvent benches are used for sample preparation, cleaning, and lithography processing in cleanroom environments.
• Provide ventilated, chemical-resistant work surfaces with integrated exhaust systems to safely handle solvents and volatile chemicals.
• Equipped with Nâ‚‚ guns, a sonicator, spin coaters, and hot plates to support a wide range of wet processing tasks including resist coating, development, and substrate cleaning.

The WS-650MZ-23NPPB from Laurell Technologies is a versatile spin coating system widely used in microfabrication, photolithography, and polymer film processing. It supports a broad range of substrates and offers fine-grained control over spin parameters for consistent, uniform coatings.

Tool Specifications:Ìý

• 2 coaters: one dedicated to e-beam resists and one for general use.
• 100-6000 rpms are capable with multi step programming.
• Solvent spinning is not allowed.